HSDPA/WEDGE module based on single-chip CMOS RF transceiver
Sirific Wireless, developer of single-chip CMOS RF transceivers for multi-mode wireless applications, will showcase its EM3200 multi-band HSDPA/WEDGE radio evaluation module at 3GSM World Congress in Barcelona, Spain.
The EM3200 module is for 3.5G mobile applications. It incorporates a complete tri-band WCDMA (bands I, II and V), quad-band GSM/EDGE radio subsystem. This compact multi-band radio module incorporates fewer than 130 components in a board area of less than 7.0 sq cm.
Central to the EM3200 radio evaluation module is Sirific’s SW3200 HSDPA/WEDGE RF transceiver. This highly integrated multi-band RF transceiver chip supports transmit and receive operation in all four EDGE, GPRS, and GSM bands, as well as five WCDMA bands (I, II, III, IV and V) with HSDPA downlink data rates up to 10.2 Mbps. It also interfaces directly with WEDGE baseband processors by means of an integrated 2.5G DigRF-compliant digital baseband interface and an analog baseband interface. The EM3200 features superior WCDMA radio front-end components from TriQuint Semiconductor. TriQuint’s TQM616017 WCDMA (cellular band) Tx module and TQM666017 WCDMA Band II (PCS band) Tx module both implement a highly efficient linear power amplifier (PA), Tx RF SAW filter and Rx/Tx duplexer in a compact design. These components facilitate a multi-band HSDPA/WEDGE radio subsystem. The EM3200 kit, which includes radio module hardware, documentation and technical support, is available now to mobile handset designers at a price of $950.
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