TI’s wireless infrastructure DSPs capture China’s 3G market
Latest 3G news from China indicates that Texas Instruments digital signal processors (DSPs) are gaining ground in this market. Two of China’s leading telecommunications companies ZTE and Datang Mobile have been using TI’s optimized wireless infrastructure DSPs to deploy time-division synchronous code division multiple access (TD-SCDMA) trials. The DSPs processors are being used in Node B base station equipment, said TI. The trials, which began in April in 10 China cities, are an important step toward deploying the 3G technology for the 2008 Beijing Olympics. China will provide 3G service in all cities hosting Olympic venues and activities.
According to market research firm iSuppli, ZTE and Datang Mobile have been awarded 83% of the base station orders issued. Deployments will occur in Shanghai, Tianjin, Shenyang, Qinhuangdao, Guangzhou, Shenzhen and Xiamen.
In January, the Ministry of Information Industry (MII) of the People’s Republic of China formally announced that TD-SCDMA would be the country's standard of 3G mobile telecommunication. According to a recent In-Stat China study, TD-SCDMA subscribers in China will increase rapidly in 2008 and reach 52 million in 2011. “We predict that more than 10,000 TD-SCDMA base stations will be located in 2007,” said Kevin Li, In-stat analyst.
“We are thrilled to join with our customers ZTE and Datang to lead the deployment of TD-SCDMA in China,” said Brian Glinsman, general manager of TI’s Communications Infrastructure and Voice Group. “The efforts of both ZTE and Datang Mobile will enable the people of China, the Olympic athletes and attendees to experience the benefit of 3G communications through China’s TD-SCDMA network. By leveraging TI’s technology across the range of Node B products, together we will enable more data and multimedia applications, delivering a richer experience.”
TI has provided its wireless infrastructure optimized DSP for both the indoor/outdoor macro and micro Node B products. Manufactured in 90 nm CMOS process, the single-chip TMS320TCI100 DSP enables base station OEMs to optimize the number of processors needed for a full carrier of TD-SCDMA. The TCI100 gives wireless service providers the heightened bandwidth needed to deliver wider network coverage areas and clearer signals. In fact, this part was first unveiled in 2004 at the 3G Hong Kong conference, as the first wireless infrastructure DSP for the China market.
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