InterDigital Inc. used the 2009 Mobile World Congress in Barcelona, Spain, to showcase the company’s integrated SlimChip HSPA Modem running the Android Mobile Platform on a live 3G network. The module was demonstrated in a Texas Instruments OMAP 3 MDP, but InterDigital noted that the modem can be efficiently integrated with a variety of applications processors, including TI’s newly announced OMAP 4.

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The SlimChip MID Module is available as a pre-integrated 3G modem option for the Zoom OMAP34x-II MDP, delivering instant wireless connectivity for voice and data with mobile broadband devices. It is suitable for use in smart phones, notebooks, MIDs, and consumer electronics. The TI MDP is a full-featured evaluation platform built around the popular OMAP34x processor.

The SlimChip Embedded Modules are standalone "wireless engines." The SlimChip MID Module supports leading mobile operating systems such as the Android Mobile Platform, Linux, LiMo, Symbian OS, and Microsoft Windows Mobile.

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