HFET-based PAs offer high linearity for WiMAX applications
TriQuint Semiconductor, Inc. has unveiled two new amplifiers for broadband wireless access (BWA), 802.16 (WiMAX) and general S-Band high-power amplifier applications. The two new amplifiers provide an instantaneous bandwidth of 200 MHz across any segment of the 3.3 to 3.9 GHz band with simple PCB layout and two external components. While designed to support the stringent linearity requirements of multicarrier applications, both devices can also deliver high saturated power and PAE. The SMT-style package incorporates internal partial matching to simplify PCB design and a high thermal conductivity copper alloy base to maximize heat removal from the amplifier.
The TGA2923-SG is a 10 W power amplifier optimized for 3.5 GHz BWA and WiMAX (802.16-2004) applications. The TGA2923 can be matched for ~200 MHz instantaneous bandwidth in the 3.3 – 3.9 GHz frequency band with only two additional external components. The TGA2923 is suitable for both BWA base station (BTS) and subscriber station (SS) applications as well as high power, high PAE S-Band applications. In a typical 3.4 - 3.6 GHz BWA application, the TGA2923 delivers 9 dB power gain, 10 W Pout, and an IMD3 level of –50 dBc at 28 dBm SCL. Typical linear power of >30dBm @ 2.5% EVM can be achieved when tested with a multicarrier OFDM-type input waveform.
The TGA2925-SG is a 5.6 W power amplifier optimized for the 3.5 GHz BTS or SS wireless equipment market. It is also appropriate for high-power, high PAE S-Band applications. Like the TGA2923, only two external components are required for ~200MHz instantaneous bandwidth in the 3.3 to 3.9 GHz range. Typical performance at 3.5 GHz will produce 11 dB nominal gain, 37.5 dBm Pout and an IMD3 level of -50 dBc at 24 dBm SCL. Linear output power of >29 dBm results in an EVM of less than 2.5% with a multicarrier OFDM-type input waveform.
Both devices are fabricated using TriQuint’s proven 0.5-micron gate-length, HFET process. Both parts are offered in a molded 2-lead, SMT-style package that is lead-free and RoHS-compliant.
Want to use this article? Click here for options!
© 2012 Penton Media Inc.
Acceptable Use Policy blog comments powered by Disqus
advertisement
Latest Issue
Features:- Android Opens Up The Operating System For Innovation
- The Future Of Apps Lies In The Enterprise And On TV
- Engineering The Differentiation Into Smart Phones
Most Popular Stories
advertisement
advertisement
