Pericom Semiconductor has introduced a family of advanced analog switches created for mobile terminal applications featuring chip scale packaging (CSP), low on-resistance, and wide voltage ranges.

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The new PI5A4xxx integrated circuits are dual high-bandwidth SPDT and SP3T CMOS analog switches housed in 2 mm x 1.5 mm x 0.6 mm CSP packaging. Designed specifically for the mobile market, these switches are being used for multiband functions and polyphonic ring tones (MIDI).

"The convergence of more features and connectivity into increasingly smaller cell phones and other mobile terminals is driving the demand for analog switches in the smallest available packages. Even with the smallest die, the plastic packaging form factor had been the limiting aspect to offering smaller footprints for PC boards," explained Shaf Rahman, Pericom marketing director. "Understanding this constraint, Pericom's micro-coated CSP packages, with a solder bump pitch of 0.5 mm for easy handling, have eliminated the plastic housing around the die. Combining the low R-On (0.5-Ohm), wide voltage ranges (1.65 V to 5.5 V), and small package, have allowed us to obtain major design wins with several top mobile terminal manufacturers," continued Rahman.

Products in the new family can operate as Mux/DeMux bus switches. This includes the PI5A4684, a low-voltage dual SPDT analog switch. Also included are the PI5A4765, a low-voltage dual SPDT audio click-less analog switch with headphone/mute detection, and the PI5A4764, a low-voltage dual SPDT audio click-less analog wwitch with shunt switches. The PI5A4213 is a low-voltage dual SP3T analog switch.

Other device features are break-before-make switching, an on-chip comparator for mute detection, high off-isolation of –42 dB to –53 dB, and a cross talk rejection of –80 dB.