The latest AMD Embedded G-Series accelerated processing units (APUs) sport thermal design power ratings of 5.5 W and 6.4 W, translating into a 39% power reduction over previous versions. Residing in 361-mm² packages, the devices integrate one or two x86 Bobcat CPU cores and a discreet class DirectX 11-capable GPU on a single die. In essence, the GPUs will enable a plethora of fanless embedded designs. Systems employing the low-power AMD Embedded G-Series platform include an industrial mobile device from Amtek, a Pico-ITX single-board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE.

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