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The fourth-generation BCM2074x systems-on-a-chip (SoCs) from Broadcom are designed to save power and improve audio quality for Bluetooth headsets. These 65-nm CMOS chips also include wind noise reduction algorithms and multi-language “voice prompt” technology. And, their integrated fast-charging systems enable headsets to charge five times faster than existing products, Broadcom says.

Driven by the company’s SmartAudio technology, the BCM2074x chips reduce background noise by nearly 40% compared to existing noise cancellation techniques, Broadcom says. The SmartAudio upgrades include dynamic wind noise suppression and near-end speech enhancement algorithms such as dynamic compression and spectral shaping that overcome challenging and annoying audio interferers.

According to Broadcom, headsets based on the BCM2074x platform also can provide more than four hours of talk time after a five-minute charge, while older and competing technologies only deliver 30 minutes or less after a similar charge. In addition, the company says, the platform doubles the overall talk time of other devices.

Further, an integrated voice prompt decoder enables users to hear multi-language voice prompts in basic and advanced modes, providing information about headset pairings, battery life, muting, and multipoint status and simplifying the user interface. The BCM2074x devices improve the pairing experience as well, in basic and advanced cases, including multipoint options.

The BCM2074x family supports Bluetooth versions 2.0, 2.1, and 3.0. Each chip provides all of the major functional blocks required for a mono headset, including the power management unit, a fast-charge capable charger, and audio codecs. The BCM20740 (single microphone), BCM20741 (single microphone with SmartAudio), and BCM20742 (dual microphone) are sampling now to early access customers.