RF front-end product manufacturer and foundry services provider TriQuint Semiconductor, Inc., has unveiled first two members of its HADRON II PA Module family; the TQM7M5012 and TQM7M5005. These second-generation EDGE PAs were designed using TriQuint’s CuFlip copper bump technology, improving RF performance while reducing current consumption to provide longer device battery life. Debuting with a 5 x 5 mm footprint, these solutions are 50% smaller than the previous generation, providing handset manufacturers additional board space to add other rich features.

Article Tools

• 

Available in EDGE-Polar and EDGE-Linear versions, both products have been optimized to deliver best-in-class current consumption in the critical GMSK mode, which significantly improves handset battery life, said TriQuint.

The TQM7M5012 for EDGE-Polar applications is aligned with Qualcomm’s newest 3G multimode transceivers. Compared to the previous generation, TQM7M5012 offers even lower Rx band noise power level to help eliminate external components in the radio. The TQM7M5005 is designed to work with some of the world’s leading 2.5G and 3G transceivers that require a linear power amplifier. TriQuint has developed RF radio application and evaluation boards for both the TQM7M5012 and the TQM7M5005 to demonstrate the features and compatibility of the devices, thus enabling phone manufacturers to shorten handset development time.

The TQM7M5005 and the TQM7M5012 is sampling to lead customers, and production is planned for first half of 2008.

www.triquint.com