Dual-CPU Chipsets Now Sampling
Qualcomm is now sampling its first dual-CPU Snapdragon chipsets. The Mobile Station Modem (MSM) MSM8260 and MSM8660 integrate two of the company’s enhanced cores running at up to 1.2 GHz. Designed to enable high-end smart phones, the solutions are third-generation chipsets from Qualcomm’s Snapdragon platform.
The MSM8260 suits HSPA+ applications, while the MSM8660 targets multimode HSPA+/CDMA2000 1xEV-DO Rev. B applications. Their CPU cores include a graphics processing unit with 3D/2D acceleration engines for Open GLES 2.0 and Open VG 1.1 acceleration, 1080p video encode/decode, a dedicated low-power audio engine, integrated low-power GPS, and support for 24-bit WXGA 1280-by-800 resolution displays.
The Snapdragon family includes the first-generation QSD8x50 with a 1-GHz enhanced core; the second-generation MSM8x55 and QSD8x50A with a 1-GHz enhanced core including multimedia optimizations and a 1.3-GHz enhanced core, respectively; and the third-generation MSM8260, MSM8660, and QSD8672 with a dual-CPU architecture and enhanced cores running at up to 1.2 and 1.5 GHz, respectively.
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