A series of products from DuPont EKC Technology, part of DuPont Electronic Technologies, is intended for the BEOL (back end of line) cleaning of copper interconnects in semiconductors. DuPont CuSolve copper post-etch residue removers are a family of aqueous formulations designed to selectively remove post-etch residue from Cu/Low K interconnect features over several technology nodes.

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DuPont CuSolve copper post-etch residue removers remove residues and polymers and maintain critical dimensions and target yields for a range of technology nodes from 130 nm to 45 nm. The first two products in the series, DuPont CuSolve EKC520 and EKC6910 copper post-etch residue removers, are now commercially available and have achieved successful qualifications and process of record (POR) adoption with semiconductor manufacturers.

DuPont CuSolve EKC520 copper post-etch residue remover is a rapid, single wafer cleaning solution for copper post-etch residue and copper oxide removal. It also effectively removes via first/trench last and trench first/via last structures; works with single and dual damascene processes; and is compatible with copper, barrier, and low-k films, and all single wafer tools.

The product meets particle performance for advanced technologies, is water-soluble and can be disposed of in aqueous solvent drains. No post-clean rinse other than water is required. DuPont CuSolve EKC6910 copper post-etch residue remover operates within similar process conditions and effectively cleans at first via, post via and etch stop layer breakthrough while maintaining critical dimensions and enhancing electrical performance.