FDK Corporation plans to release four multilayer chip baluns for WiMAX and mobile WiMAX applications next month. Offering 1.6 x 0.8 ｘ 0.6 mm dimensions, they are the world’s smallest multilayer baluns with a typical insertion loss of 0.6dB in the frequency range of 2.5 GHz to 3.6 GHz, claims FDK. These multilayer chip baluns are necessary for impedance matching between equilibrium / non-equilibrium RF circuits used in WiMAX communications equipment. The supplier attributes the new chip baluns low insertion loss performance in a 1608 size to its low temperature firing materials and optimization of the multilayer pattern, which are developed from the company’s established ceramics material, multilayer process technology, and CAE. The baluns comply with the European Union’s RoHS directives. Complete specs are in the table below. And sampling of the new baluns will begin next month. www.fdk.co.jp

Specifications