SanDisk’s next-gen iNAND and iNAND Ultra embedded flash drives (EFDs) sport smaller and trimmer form factors measuring as little as 11.5 by 13 by 1 mm (see the figure). The company reduced its iNAND package sizes using 24-nm NAND memory chips. It also trimmed package heights through advanced packaging technologies. The iNAND drives use proprietary three-bit-per-cell (X3) NAND flash technology while iNAND Ultra drives rely on two-bit-per-cell (MLC) NAND flash technology. Both iNAND and iNAND Ultra EFDs offer up to 64 Gbytes of storage in a 12- by 16-mm JEDEC standard package, and 32-Gbyte versions come in 1.2-mm package heights. Also, iNAND drives with capacities up to 8 Gbytes are available in 11.5- by 13-mm sizes. Both EFDs will be available in the third quarter.

SanDisk’s next-gen iNAND and iNAND Ultra embedded flash drives (EFDs) sport smaller and trimmer form factors measuring as little as 11.5 by 13 by 1 mm.

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