TT electronics IRC Advanced Film Division has developed a flip-chip Thevenin termination network to maximize signal integrity in high-speed digital circuits. Designated CHC series, the 18-resistor ball-grid-array (BGA) network is flip-chip-attached to a board or a substrate to combine the benefits of flip-chip miniaturization with the reliability of a BGA. In addition to reduced drive requirements and power dissipation, the Thevenin resistive terminators provide both pull-up and pull-down functions for the circuit. This package eliminates all wire bonds to effectively reduce internal parasitic inductance of the resistor network to near zero. It also minimizes external traces on the PC-board. The resistor network is aimed at applications like DDR memory termination, ECL/PECL high-speed logic termination, and single-ended and differential signaling termination.

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The Thevenin termination network comes in a wide range of standard and custom resistance values. The devices also feature absolute TCRs to ±100 ppm/°C and standard tolerances to ±1% with operating temperatures from 0 to 70°C. Typical pricing for the CHC series is $0.99 each in quantities of 10,000.