Palomar Technologies has introduced the Model 8000 gold ball-and-stitch thermosonic wire bonder for complex, precision gold wire-bonding applications where flexibility, ease-of-programming and high throughput are desired. The equipment is suited for the assembly of devices with multiple die in a single package, high I/O counts and gold ball bumping for flip chip.

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The Model 8000 incorporates a large area 12 inches x 6 inches x-y range linear motor-actuated positioner, carrying a dual axis voice-coil driven bond head with a rectilinear z-stroke of 800 mils. The equipment’s Windows NT software provides a rich programming environment while incorporating in-process monitoring tools such as real-time deformation monitoring to track set down on each individual board. The full 72 square inches of work area enables large substrates to be bonded in one pass, while accomodating dual handling systems for virtually zero-wait-state indexing and maximized throughput.

Accurate targeting and wire placement of better than 5 microns are achieved using on-screen video for point-and-click selection of bond placement sites. The combination of Cognex vision and dual-source programmable LED lighting also contribute to accurate targeting and placement. Offering SMEMA compatibility, the equipment measures 31.5 inches x 37.5 inches by 70.0 inches.