Incremental Improvements Define The 2012 Mobile World Congress |
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Louis E. Frenzel, Editor in Chief
The usual players all showed up at this year’s Mobile World Congress in Barcelona with lots of improved devices, but no real game-changing breakthroughs... |
Coaxial Connectors Achieve Market’s Lowest Profile
Primed for ultra-slim and compact products, the JSC series from Murata Electronics North America emerges as the lowest-profile RF coaxial connectors with a maximum profile of 1 mm, according to the company. ...
GSM/GPRS Modem Handles M2M Exchanges
Negotiating M2M data exchanges, the Cellgo GSM/GPRS modem from eDevice enables power-constrained devices to connect to wireless cellular networks through a single cable carrying both data and power....
4G/AWS Amplifier Improves Service on the AWS Band
The reconfigurable AWS amplifier, the SureCall CM2100 62dB, boosts the range and reception on calls, as well as improves data and voice service for all carriers on the AWS band....
Class G Amplifier Boosts Efficiency With High-Quality Audio In Mobile Products
Texas Instruments TLV320DAC3202 class G amplifier provides audio quality without draining the battery or increasing EMI in portable devices. ...
Wireless Data Modem Provides 4/16/64QAM
Eliminating the need for programmable DSPs and codec chips, the CMX7164 multimode wireless data modem IC from CML Microcircuits integrates 4/16/64QAM and root raised cosine 2/4FSK baseband modem functions....
iNEMO Engine Enables New Level of Motion-Sensing Apps
The fusion of motion-sensor data gives smartphone handsets, tablets, and gaming devices new utility and features....
30-nm Mobile DRAM Achieves Industry’s Highest Density
Samsung is rolling out the industry’s first production of 4-Gbit LPDDR2 DRAM chips using 30-nm class technology to enable thinner, lighter smart phones, tablets, and other mobile devices with longer battery life....
Tri-Axis Analog Gyroscope Measures 4 mm By 4 mm By 1 mm3
The STMicroelectronics L3G462A relies on a single sensing structure for measurement along three orthogonal axes, eliminating any interference between axes and boosting accuracy and reliability....
Antennas Boost 4G Device Performance, Ease Design Chores
The SkyCross State-Tuned Isolated Mode Antenna Technology (ST-iMAT) conserves space while providing users with more design flexibility to enhance the performance of 4G networks....
HSPA+ Module Measures A Mere 795 mm2
Trumpeted as the world’s smallest 3.75G Penta-band HSPA+ module, the HE910 from Telit Wireless Systems measures 28.2 by 28.2 by 2.6 mm in an LGA package....
Mobile WiMAX Chip Hoists Integration Bars, Trims Footprint And Costs
Trumpeting loftier integration levels and a smaller footprint while forecasting lower system costs, the Sequans SQN1310 Mobile WiMAX chip draws upon the company’s SQN1200 series architecture and software....
5-GHz Front-End Modules Address High-Performance Applications
RFMD is expanding its 5-GHz Wi-Fi product portfolio to include two new 5-GHz high-band Wi-Fi front-end modules (FEMs) with integrated PAs, the RF5506 and the RF5516....
PWM Controller Enables Ultra-Low Standby Power
The Fairchild Semiconductor FAN302HL PWM controller keeps standby power low by minimizing standby input power consumption to less than 10 mW at 230 V ac, beating the efficiency standards of Energy Star Program Requirements for Computers Version 5.0....
Enhanced BSP Accelerates Embedded System Design
Pentek has added features to the ReadyFlow board support package (BSP) that promise to simplify embedded development for the Cobalt family of Xilinx Virtex-6-based FPGA modules. ...
30-V N-Channel and 20-V P-Channel MOSFETs Feature Low Profile
The Vishay SiA444DJT MOSFET features a 0.6-mm profile and the SiA429DJT MOSFET features low on-resistance for a p-channel device with a sub-0.8-mm profile....
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