Incremental Improvements Define The 2012 Mobile World Congress |
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Louis E. Frenzel, Editor in Chief
The usual players all showed up at this year’s Mobile World Congress in Barcelona with lots of improved devices, but no real game-changing breakthroughs... |
Copper-to-fiber-optic converter supports GbE data rates
Stratos Optical Technologies’ dual RJ45-enabled media converter, the The EBK-xRJ-xxVx GE, provides a single, stand-alone bulkhead conversion solution for multimode Gigabit Ethernet links....
HYPERBGA delivers speed with reliability
HyperBGA package from Endicott Interconnect Technologies is a PTFE-based coreless semiconductor package that enables silicon devices to run at extremely high speeds. ...
High power termination offers improved performance
BroadWave Technologies’ model 555142100 is a 50 Ohm, 100 Watt termination with a 7/16 DIN male connector. ...
Signal generator sets new benchmark for frequency switching speed
Giga-tronics Inc. has released a new 2520GTA signal generator that offers unprecedented frequency and amplitude switching speeds of <350 µS for any step size over its full frequency range and typically <200 µS for frequency steps up to 100 MHz within a band. ...
Standard RCC products offer a quick alternative to BeCu parts
EMI shielding and antenna solutions provider Laird Technologies has announced a quick alternative to beryllium copper products. ...
WiMAX transceiver eliminates SAW filter
Maxim Integrated Products’ MAX2837 single-chip WiMAX RF transceiver uses a zero-IF architecture and integrates a digitally controlled crystal oscillator, eliminating a SAW filter and extra VCO circuitry (these additional elements are needed by existing superheterodyne solutions). ...
Design platform targets 45 nm CMOS
STMicroelectronics' 45 nm CMOS design platform with multiple threshold transistors cuts the silicon area by half compared to designs implemented in 65 nm technology...
Forecast projects limited impact for Qualcomm chip ban
The International Trade Commission's decision to ban U.S. imports of some mobile phones that include certain Qualcomm 3G chips will have only a limited impact on the global wireless communications industry in the short term, according to iSuppli....
Firms continue joint fabrication-process development
Silterra Malaysia and IMEC have signed an agreement for a joint development project to create a foundry-compatible 90 nm CMOS process technology with the intention to further scale to 65 nm. ...
World’s smallest DSCs enable smart sensors
Microchip Technology’s dsPIC33FJ12GP family represents the world’s smallest Digital Signal Controllers, and is therefore well suited for a new class of smart-sensor applications in which digital techniques enhance the performance of a variety of electronic sensors. ...
Software for 3D full-wave EM field simulation raises the bar for accuracy and capacity
At the IEEE MTT-S International Microwave Symposium this week, Ansoft Corporation released a new version of its 3D full-wave electromagnetic simulation software HFSS. ...
Fully hermetic packages operate up to 50 GHz
Microwave and millimeter wave packaging supplier StratEdge has readied a line of high performance semiconductor packages that operate from DC to 50 GHz in hermetic versions. ...
Satcom power amplifiers deliver high performance from smaller area
Using gallium arsenide based 0.15µm pHEMT process with three layers of interconnecting metal on 50 µm substrate material, TriQuint Semiconductor has released two new satellite communications high power amplifiers that offer improved performance with overall size reduction. ...
Communications satellites launched
Four satellites built for Globalstar by Space Systems/Loral were launched May 29 on a Soyuz launch vehicle from the Baikonur Cosmodrome in Kazakhstan....
Military-equipment enhancements require backward compatibility
Many times when a branch of the armed forces considers a new weapons system, one of the key aspects to be evaluated is how effectively the potential addition will integrate with existing arsenal....
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