In an effort to streamlined mobile handsets with lower BOM, Infineon Technologies AG and SkyCross have collaborated and rolled out the Infineon X-GoldTM102 chip. This chip integrates SkyCross’ iMAT antenna, which offers multiple feeds—eliminating the necessity for a switchplexer in a handset. Infineon’s single-chip platform solution will also eliminate the need for conventional RF components. In short, the companies look to this product to lower BOM without sacrificing performance.

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Infineon's platform includes power management, two SIM interfaces, and RF on a single chip. This chip is currently available on the market, and future generations are in the works. The X-GoldTM102 chip will be on display at 2009 GSMA Mobile World Congress in Barcelona, February 16 through 19.

"Cost is a main driver in each of the mobile phone segments, but pressure is particularly intense for the rapidly growing, high volume, ultra-low cost segment," said Horst Pratsch, Vice President of Marketing for Entry Phone Business at Infineon. "This pressure encourages innovation, and we are pleased to address the challenge with the talented team at SkyCross."

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