Ansoft Corp. has unveiled a new Turbo Package Analyzer (TPA) v4.2, which offers new bidirectional integration between Synopsys' Encore package-design software and Ansoft's state-of-the-art 3D electromagnetic simulation. It enables full parasitic extraction of complex IC packages, such as ball-grid arrays (BGAs).

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As a result of this collaboration, Ansoft's advanced electromagnetic technology for package extraction and characterization can be accessed directly from Encore product. Plus, with AnsoftLinks, a tool for simplifying data import and export between EDA and CAD packages, TPA v4.2 will generate resistance, inductance and capacitance (RLC) models directly from popular package design tools. It accepts CAD data and fully characterizes the entire package in three dimensions. The 3D analysis provided by the TPA v4.2 extraction engine can solve any BGA package structure, including wirebonds, pads, vias, tapered traces, solder balls and non-ideal power and ground structures.

For crosstalk simulations, TPA v4.2 automatically provides a multiconductor coupled RLC model for each lead in the package. The user specifies the number of nearby (adjacent) leads for coupling, and the program automatically calculates all of the parasitics.

Key TPA highlights include:

• RLC extraction via 3D field solvers
• Full package extraction via automatic partitioning
• Critical net analysis
• Seamless integration of TPA within Synopsys Encore
• Outputs RLC, SPICE, IBIS .pkg
• Package layout support through AnsoftLinks for Cadence and Zuken