Microbonds, a developer of insulation for bonding wires and related processes, together with Tanaka Denshi Kogyo, a supplier of gold bonding wire, has certified the technology readiness of Tanaka to manufacture X-Wire. Microbonds' X-Wire Technology is an interconnect solution that consists of an insulation applied to bare bonding wires. Actual production quantities of Tanaka X-Wire are expected to be available in the middle of the first quarter of this year.

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"We are pleased to have met our objective of having Tanaka Denshi be production capable for X-Wire production from its Saga, Japan, facilities as scheduled. Our long-term relationship with Tanaka allows customers a unique and compelling solution to many interconnect challenges. We look forward to production shipments of X-Wire with a partner known for its long-term commitment to quality, technical leadership and market responsibility," said John Scott, CEO of Microbonds.