InterDigital’s SlimChip Half-Mini PCIe module and SlimChip MID module are optimized to be embedded in mobile broadband devices. These compact wireless modules use InterDigital’s high-performance SlimChip HSPA baseband IC.

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The SlimChip Embedded Modules are AP agnostic, meaning they can interface with a variety of APs with maximum power efficiency and throughput. To accelerate customer evaluations and product development, the compact SlimChip Module has been pre-integrated with the Texas Instruments OMAP34x processor-based development platform, as well as the telephony software for the Android mobile platform.

According to InterDigital, the SlimChip Half-Mini PCIe Module is the only HSPA Half-Mini PCIe module available in the market. It uses the standard PCIe interface, enabling simple connectivity for laptops, notebooks, and UMPCs. The MID module supports popular interfaces for direct connection to application processors. Additionally, all the support software, applications, and interfaces for Windows XP/Vista, Windows Mobile, and Linux operating systems are included for quick time-to-market.

InterDigital will demonstrate the SlimChip Embedded Modules, along with its Baseband ICs, Mobile Reference Platforms, and Modem IP, on a live HSPA network and display its SlimChip during the 2009 GSMA Mobile World Congress in Barcelona, Spain, Feb. 16-19. In addition, InterDigital will demonstrate its Media Independent Handover middleware, enabling uninterrupted data streaming when switching between 3G and Wi-Fi networks.

The InterDigital SlimChip MID module uses the SlimChip HSPA baseband IC and is optimized for mobile broadband devices.

The InterDigital SlimChip Half-Mini PCIe module uses the standard PCIe interface, enabling simple connectivity for laptops, notebooks, and UMPCs.

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