System-in Package RF Design and Applications from Artech House offers guidance on SiP (system-in-package) RF design techniques. It covers RF components, together with packaging strategies, to meet requirements for reliability, manufacturability, RF performance, size and cost. It explains design rules for laminate and LTCC modules and the trade-offs between them, and presents working guidelines for IC partitioning decisions early in the design phase.

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Embedded filter designs with RF architecture trade-offs for performance and cost are discussed. Other passive circuitry is also detailed, such as couplers, BALUNs, and antenna switches that can be integrated in the package to save cost and space. The book addresses techniques for the integration of all wireless functions into one module, and explores embedded passive and embedded die capability. Details on shielding for a complete licensed transceiver are also included. Additional topics include "real-world" issues pertaining to RX architecture with VCO grounding, power control EVM effects, and modeling. The book features over 100 illustrations.