Taconic’s HyRelex series is a family of low-loss, high-reliability, thin, flexible interconnect materials. HyRelex laminates can be used in conjunction with HyRelex bond-ply and cover-lay for a wide range of applications including high-frequency circuits and controlled-impedance, low-loss cables. HyRelex is robust enough to retain its electrical and mechanical properties in applications exposed to harsh environments.

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HyRelex laminates are available with dielectric constants of 2.60 and 2.90 (rated to 10 GHz), along with closely matched bond-plies (dk 2.70, 3.00) and cover-lays (dk 2.70). Volume resistivity is 10⁷ M Ω/cm Laminates are available as thin as 0.001 in. (25 µm) and can be ordered with various copper styles. For pricing and availability, contact Taconic.