Ultralow inductance capacitors increase capacitance in a given board space
The new LGA (land grid array) capacitor from AVX uses a patented termination, together with a vertical electrode design and process to produce superior low-inductance decoupling capacitors. These components are well suited for MPU, GSP, DSP, FPGA and ASIC with regard to package requirements, as well as for other high-performance system designs that require low-inductance capacitors.
An important differentiating factor for the LGA device family is that AVX has been able to release the industries first ultralow inductance, 0204 size component. The specific pad layout of the 0204 part makes it a suitable replacement for an existing 0201 part, thereby significantly increasing the capacitance per unit area in a given board space. In addition, the termination area is larger, thereby providing improved ease of assembly.
These factors provide a unique benefit to designers who in the past have been forced to move to smaller case sizes or to multiterminal (more complex to assemble) devices to achieve the required low inductance values. This can significantly reduce the number of devices required to optimize system performance.
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