To address new class of wireless applications requiring faster streaming of audio and data files across ZigBee network, Freescale Semiconductor has introduced a single-chip platform solution based on the ZigBee specification that is designed to deliver the industry’s lowest power consumption and highest performance. The MC1322x platform is engineered to support battery life of up to 20 years, doubling the expectations for current ZigBee solutions, claimed Freescale.

Article Tools

• 

Housed in a platform-in-package (PiP), the MC1322x integrates the essential components of a ZigBee application within a single package, thereby reducing component count and system cost. Plus, it integrates a 32-bit microcontroller unit (MCU), a fully compliant IEEE 802.15.4 transceiver, balun and RF matching components. All integrated into a small-footprint land-grid array (LGA) package that virtually eliminates the need for external RF components, said the manufacturer. The platform solution also features a TurboLink technology mode, engineered to increase data rates by up to 2 megabits per second (Mbps) between nodes.

The MC1322x devices will switch automatically between the IEEE 802.15.4 protocol and TurboLink technology packets, allowing the developer to take advantage of the high-speed capabilities, while simultaneously controlling and monitoring a ZigBee mesh network. This high-speed capability creates a tremendous opportunity for new designs and applications, said the supplier. Designed to support battery-powered applications, it is optimized for Lithium-ion or NiCd batteries. In addition, it can use standard alkaline batteries that can provide up to 20 years of system life.

Since all RF tuning components and balun are contained within the MC1322x package, it requires only an antenna and crystal to be connected for operation. However, the company plans to add RAM- and flash-based PiP solutions to the MC1322x family.

While MC1322x device samples will be offered to key OEM customers in May, general market sampling is planned for the late fourth quarter. The company plans to offer the MC1322x device in two package options: a 9.5 mm x 9.5 mm LGA and a 7 mm x 7 mm QFN. The devices also are planned to be available in standard mode or TurboLink technology mode. Suggested resale pricing for the standard mode devices in LGA packaging is $5.50 in 10k quantities.