Ceramic, high-speed packages house Rockwell’s T/H devices

Rockwell Scientific Company (RSC) has selected StratEdge to provide the packages and assembly services for RSC’s widest bandwidth track-and-hold (T/H) device, the RTH050 high-speed mixed-signal circuit for commercial and defense applications.

Article Tools

The Rockwell Scientific package is based on the patented StratEdge leaded LCC (low-cost commercial) family of DC to 23 GHz amplifier packages. This ceramic microwave package features four RF leads and multiple DC leads for attachment to the next level of the system without sacrificing electrical performance that is critical to microwave technology. The cavity was customized to fit the RSC chip and other components, and the RF traces were optimized for speeds in excess of the current chip requirements. StratEdge designed and manufactured the package, as well as performed the polymer die attach, automated gold wedge wire bonding, lid sealing and marking services, and final lead trim.

The RTH050 is a 15 GHz bandwidth 1 Gsps dual track-and-hold circuit with extended hold time for ultra-wideband data acquisition. Also being introduced in the StratEdge package is the RTH055, an RTH050 with integrated 12 dB input attenuators.

“This is a prime example of a customer taking advantage of our high-frequency packaging technology,” said Casey Krawiec, director of North American Sales at StratEdge. “The engineers at Rockwell Scientific recognized the superior performance of our packages and our high-frequency assembly expertise. They needed a package that could meet all of their requirements including electrical, environmental, thermal, and next-level assembly - and we delivered.”

Want to use this article? Click here for options!
© 2012 Penton Media Inc.


Acceptable Use Policy blog comments powered by Disqus


Latest Issue

Features:

View Entire Issue

Most Popular Stories

Resources

Special Coverage

CTIA Wireless IT & Entertainment 2010

Read the latest from the show...