Incremental Improvements Define The 2012 Mobile World Congress |
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Louis E. Frenzel, Editor in Chief
The usual players all showed up at this year’s Mobile World Congress in Barcelona with lots of improved devices, but no real game-changing breakthroughs... |
Advances in SAW technology
[For a copy of this article in PDF format, which displays figures and equations, click here. Requires Adobe Acrobat Reader, free download.] In today's...
To buy…or to lease…that is the question
[For a copy of this article in PDF format, which displays figures and equations, click here. Requires Adobe Acrobat Reader, free download.] Today's rapidly...
RF2460
RF Micro Devices announces the RF2460 LNA mixer a complete receiver front-end chip for the PCS CDMA market. Based on silicon germanium (SiGe) technology,...
literature
Catalog covers EMC components A new 256-page EMC components catalog from Schaffner EMC provides detailed technical data on a range of filters, chokes,...
product focus interconnect/interface
Solderless interconnect for mPCs Teledyne Interconnect Devices introduces the MicroConn connection for land grid array (LGA) applications. The products...
BUSINESS BRIEFS
Seavey Engineering creates new consulting services division - Seavey Engineering Associates (SEA), Pembroke, MA, has formed a new division, SEA Consulting...
Simulation and design of RF filters
[For a copy of this article in PDF format, which displays figures and equations, click here. Requires Adobe Acrobat Reader, free download.] A unique filter...
Transceiver architectures for wireless ICs
[For a copy of this article in PDF format, which displays figures and equations, click here. Requires Adobe Acrobat Reader, free download.] Most of tomorrow's...
Failure analysis techniques for semiconductors and other devices
[For a copy of this article in PDF format, which displays figures and equations, click here. Requires Adobe Acrobat Reader, free download.] Knowing why...
products
Test set for wireless amplifier and digital radio Celerity's Digital Broadband Test CS2010W "virtual" test instrument is designed for power amplifier,...
Evaluating IC packaging
As high-speed communications data rates gear up for 10's of Gb/s, packaging issues become a critical design parameter....
3G and beyond - The future of wireless technologies
[For a copy of this article in PDF format, which displays figures and equations, click here. Requires Adobe Acrobat Reader, free download.] Multimedia...
3G design studio
Elanix announces its latest software tools for third-generation (3G) wireless system design and test. The 3G Design Suite provides high-performance simulation...
product focus - software
Bluetooth protocol stack for Java platforms XJB 100, from Zucotto Wireless, is a Bluetooth protocol stack written in the Java programming language. XJB...
literature
Catalog features PCB hardware APW Electronic Solutions introduces a 96-page catalog dedicated to its complete line of PCB hardware. The new APW printed...
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