Letters Of Intent Form Wireless Power Trio
Qualcomm and Powermat have signed a non-binding letter of intent (LOI) to explore the development of unique wireless power solutions. Together, the companies will investigate the convergence of tightly and loosely coupled wireless power technologies to deliver a flexible coupling wireless power solution. Additionally, they will build an industry alliance supporting coupling-based wireless power, investigate dual-mode receiver ASICs that work with Qualcomm’s Wipower technology and are backward compatible with Powermat’s charging mats, and have Powermat offer a single-mode wireless power solution based on Qualcomm’s WiPower technology. On a similar note, Qualcomm and Duracell have also signed a non-binding LOI in hopes of developing an industry alliance that supports and promotes flexible coupling-based wireless power topologies for consumer markets. The companies are shooting for broad OEM and consumer adoption of a unique wireless power technology and to advance an industry standard.
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