Singapore-based ST Assembly Test Services Ltd. (STATS) has qualified a new environmentally friendly version of its Flip Chip Land Grid Array (FCLGA) package.

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The FCLGA offers a smaller form factor with increased routing density and improved electrical performance. A lower-profile, 0.65 mm nominal package thickness is achieved by using a thin core, high density laminate substrate, solder wetable I/O lands and thinned die, making the FCLGA suitable when electrical performance, form factor, and package height minimization are primary requirements. In addition, the developer has also broadened its product offering beyond traditional eutectic tin/lead to include increasingly popular lead-free alloys.

“With an extensive lead-free program built over the years, STATS is well-positioned to offer customers a cost-effective, high volume, lead-free flip chip in package solution,” said Han Byung Joon, STATS chief technology officer. “FCLGA addresses the intense performance demands of wireless applications, as well as growing market demand for environmentally friendly semiconductor devices.”

The lead-free FCLGA is targeted at high-frequency and/or high data rate applications such as mobile phones, WLAN modules, PDAs, digital cameras and camcorders, which are driving low profile, high-performance, environmentally friendly packaging options. As with all of its flip chip package offerings, STATS provides full turnkey support, including advanced design and simulation support, wafer bumping, wafer probing, as well as assembly and test.