Radio for communications in harsh environments

AeroComm introduces its family of industrial-temperature 2.4 GHz frequency-hopping spread spectrum transceivers. The AC3124 line is designed to withstand hostile environments, allowing for operation at temperatures of -40° to +80° C. The transceivers are designed to replace complex, bulky wiring in applications such as telemetry and SCADA, and process monitoring in environmentally severe facilities. The modules meet requirements such as small size, simple integration, long range, low power consumption and efficient data throughput. Data rates as high as 115.2 Kb/s are available. Based on AeroComm's proprietary FHSS technology, they are highly resistant to interference and security breaches. They are available in a short-range, power-efficient 10 mW version for battery-powered products, and a higher-power 200 mW version for miles of outdoor range. All devices feature identical dimensions, connectors and software interfaces for interchangeability. The transceivers operate in point-to-point or point-to-multipoint client/server architecture.
AeroComm
www.aerocomm.com

Low-noise amplifier integrated with Rx/Tx duplexer

GHz Technologies announces a new line of active microwave filters and duplexers for L, S and C-band.

The model DPL-LNA-2327-10-20 Duplexer-LNA assembly is designed for MMDS applications and integrates a high-power cavity transmitter filter, receiver filter and low-noise amplifier into a single compact module for performance improvement and space savings. The module offers greater than 20 dB gain with a noise figure of less than 3dB for the receive channel and insertion loss of less than 1.5 dB for the transmit channel. Isolation between channels is greater than 60 dB while input and output return loss is less than 16dB with SMA connectors. The unit operates from 12 VDC (100 mA).
GHz Technologies
www.ghztech.com
sales@ghztech.com

Integrated RF module for GSM/GPRS handsets

Anadigics announces the AWT6200 PowerPlexer, the first in a new family of integrated RF modules for GSM/GPRS wireless handsets. The device integrates an InGaP HBT power amplifier, GaAs pHEMT multi-throw RF antenna switch, passive filters, integrated passives and analog control integrated circuits in a small module package. This approach simplifies handset designs, reduces handset sizes, lowers costs and reduces time-to-market. The AWT6200 delivers class 12-capable GPRS performance for dual-band GSM/DCS applications and is packaged in a 12 mm × 12 mm × 1.5 mm SMT module package. The device contains two power amplifiers, a low-pass harmonic filter, a high-linearity pHEMT RX/TX switch, and a CMOS controller.
Anadigics
www.anadigics.com

Low-power RF transceiver

Chipcom has developed the CC1000 RF transceiver for short-range RF applications. The module is a single-chip UHF transceiver developed for low power consumption and low voltage operation. Based on a 0.35 μmm CMOS technology, it offers a combination of high integration, high performance and flexibility. The CC1000 is designed mainly for FSK systems in the ISM/SRD bands at 315, 433, 868 and 915 MHz, but can easily be programmed for operation at other frequencies between 300 and 1000 MHz. The low power consumption and the high integration level make the CC1000 suitable for remote keyless entry (RKE), home automation (HA), automatic meter reading (AMR), and wireless alarm and security systems.
Chipcom
www.chipcon.com
wireless@chipcon.com

Programmable downconverter for cellular

Intersil announces the ISL5416 quad programmable downconverter (quad-PDC) that specifically targets third-generation (3G) wireless protocols while supporting legacy standards. The filter configuration of the quad-PDC allows the integration of four discrete wideband channels in a single circuit and includes all the necessary post processing functions to complete the entire channelization process for cellular base station receiver applications. The system receives incoming wideband signals from high-speed analog-to-digital converters and tunes, filters and decimates the signal from an intermediate frequency to a baseband signal. Specifically designed to meet the demands of the 3G market, it features multi-stage filtering, automatic gain control and re-sampling capability. When operating in concert, the filtering capability provides >100 dB of out-of-band filtering capability to address even the most aggressive of 3G adjacent channel power ratio ACPR specifications.
Intersil
www.intersil.com

Specifications at a glance:

• Multistage filtering
• Automatic gain control
• >100 dB out of band filtering

Power amplifier ICs support Bluetooth, 802.11b

SiGe announces the SE2520L, a linear 2.4 GHz power amplifier that is fully compliant with the Bluetooth 1.1 and IEEE 802.11b specifications. Designed to leverage a silicon germanium BiCMOS technology, the device offers 50% lower current consumption. The combination enables effective multi-mode power amplifiers for the range of portable and stationary 2.4 GHz applications. Capable of operating at a duty cycle of 100%, the SE2520L delivers as much as +22 dBm of linear output power with an adjacent-channel power ratio (ACPR) of less than -30 dBr per 100 KHz. This allows the SE2520L to enhance signal integrity over the specified range, enabling optimal performance of both technologies. The SE2520L operates at a typical power consumption of 138 mA. This reduction in current consumption is achieved through the combination of power-management control features and an efficient silicon germanium structure that provides high thermal conductivity and low junction temperature. The device operates using a single 3.3 V supply.
SiGe
www.sige.com

Bluetooth platform offers innovative performance

Motorola announces a comprehensive Bluetooth platform to meet today's demanding designs. It provides a V1.1-compliant Bluetooth solution with high-quality audio, certified interoperability and 802.11b coexistence, as well as embedded software, development tools, and reference design kits. It offers a design that can provide as much as four times the range, plus capacity for twice as many ad hoc networks and operates 50% closer to noise sources than is required by the Bluetooth standards. The JD/MLSE data demodulation technology enables a robust link near 802.11b WLAN connections and other sources of interference in the public ISM band, such as microwave ovens and cordless phones. It provides greater range, more capacity and improved quality compared with “bit slicing”-based radios.
Motorola
www.motorola.com

Specifications at a glance:

• V1.1-compliant baseband processor with Bluetooth standard host controller interface

• V1.1-compliant RF BiCMOS transceiver

• V1.1 power amplifier

• Power management IC

Custom design and fit embedded antennas

Trak introduces the model 506051E embedded antenna as the newest member of the Covant series of embedded antennas. This model is used in wireless LAN, IEEE 802.11, bar code scanners, and point-of-purchase RFID applications. The antenna is custom-designed to specific size, weight, shape and performance, while providing easy assembly placement. The model 506051E supports a 5.250 to 5.350 GHz frequency range, has a VSWR of 2.0:1, impedance of 50Ω and linear polarization.
Trak
www.trak.com
tecom@trak.com

GSM/GPRS system-on-a-chip

Texas Instruments has developed a chipset that provides wireless device manufacturers with a complete “antenna-to-applications” solution and reference design for enabling optimal performance and power savings for 2.5G mobile devices. TI's Omap platform technology lies at the heart of the chipset and is the first processor to integrate a GSM/GPRS modem and a dedicated applications processor on a single chip that supports next-generation, bandwidth-intensive wireless applications. The programmable DSP-based chipset leverages the Omap710 processor to enable services such as multimedia messaging, short video clip and Internet audio downloads, e-mail, real-time Web browsing and games. The TCS2500 chipset combines the Omap710 processor with TI's analog baseband and RF technology. It incorporates a DSP-based GSM/GPRS digital baseband engine and an ARM9 microprocessor with integrated MMU and cache for complete modem and applications support. The Omap710 features full support of advanced mobile operating systems such as Microsoft's Windows CE, Palm OS, Symbian OS and Linux. In addition, the Omap710 provides Java programming support and gives wireless device manufacturers access to a network of applications.
Texas Instruments
www.ti.com

3.5 V, multi-standard, multi-band PA module

The RM805 is a fully matched 28-pin LCC surface-mount power amplifier (PA) module designed for mobile units operating in the 806 to 849 MHz frequency band. All active circuitry is contained in the module, which includes on-board CMOS-controlled bias circuitry as well as input and interstage matching circuits. The output match is realized off-chip within the module package to optimize efficiency and high power performance (P_sat typ @ 35.8 dBm) into a 50Ω load.
Conexant
www.conexant.com

Specifications at a glance:

• PMR, TDMA, AMPS, TETRA support
• 3.5 VDC supply voltage
• 28-pin LCC package

Single-chip transceiver for wireless networking

Global Communication Devices announces the LS2401 true single-chip transceiver, a general-purpose radio chip that is designed to operate at 2.4 GHz in WLAN, as well as in Bluetooth and HomeRF applications or in proprietary unlicensed radio systems. The LS2401 includes a direct conversion receiver from RF to analog I/Q baseband signals, and can support data throughputs above 22 Mb/s. It features an advanced transmitter design delivering the full transmit power specified in IEEE 802.11b from an integrated on-chip power amplifier. The transceiver can operate in either frequency-hopping or direct-sequence spread-spectrum modes and interfaces with leading baseband and MAC processors for easy integration into existing designs.
GCD
www.gcdchips.com
www.conexant.com

Chip-on-glass 64 × 128 graphics display

Displaytech announces the 64128COG series, a new 64 × 128 graphics LCD module using chip-on-glass technology. The module is 56.0 mm × 39.0 mm × 2.0 mm max. thickness, with view area of 50.0 × 25.0. Dot pitch is 0.36 mm. The display can be ordered in either STN or FSTN fluid and has pin connections as standard. The driver is connected directly to a microprocessor and accepts 8-bit serial or parallel display data and stores in an on-chip display data RAM of 65 × 132 bits.
Displaytech
www.displaytech-us.com

Second-generation radio modem/baseband processor

Silicon Wave announces additions to its second-generation Bluetooth product portfolio with the CDMA chipset compatible SiW1702 radio modem, the GSM chipset-compatible SiW1703 radio modem and the 32-bit ARM core-based SiW1770 baseband processor with integrated flash memory. With a 1.8 VDC design, the SiW1770 offers low power applicability and is equipped with 256 kB of integrated flash. These new ICs decrease power consumption by as much as 90%, system cost by 30% and size by 60%. These second-generation products are highly integrated and reduce the number of external components required, lowering the total system BOM cost and reducing the total size of a complete Bluetooth solution. The products are targeted for integration into mobile phones, notebook and desktop PCs and accessories, printers and PDAs. All components are Bluetooth specification version 1.1-compliant.
Silicon Wave
www.siliconwave.com

Specifications at a glance:

• 32-bit baseband processor
• 1.8 VDC operating voltage
• 256 kB integrated flash memory
• Bluetooth 1.1-compliant

3G cdma2000 1X baseband-to-RF transmit processor

Qualcomm introduces the RFT5600 baseband-to-RF transmit processor. The device performs all transmit signal processing functions required in wireless CDMA handsets between the analog baseband output from the mobile station modem chip and power amplifier for IS-95A/B and 3G CDMA2000 1X applications. The RFT5600 device, together with the PA, enables a complete two-chip Tx radio implementation using minimum circuitry. Features include a triple PLL comprised of a UHF PLL and receive and transmit IF PLLs. The device also includes a quadrature baseband-to-IF upconverter, a programmable PLL for generating the Tx IF frequency, Tx IF VCO, single sideband upconversion from IF to RF, one cellular and two PCS driver amplifiers, and Tx power control through an 85 dB VGA. The single sideband upconversion eliminates the need for an IF surface acoustic wave (SAW) filter normally required between the upconverter and driver amplifier. The device will operate over the following Tx frequency ranges: 824 to 925 MHz and 1750 MHz to 1980 MHz. The range of supply voltage is from 2.7 to 3.3 VDC. Its operating modes are controlled by the MSM chip and include band selection and frequency programming, gain control, selective power-down, and punctured CDMA transmission (gated Tx power).
Qualcomm
www.qualcomm.com

Board-level timing control module

Corning introduces the model FS300 board-level product containing embedded micro controller intelligence for bi-directional communications with a host system. It uses a Corning oven-controlled crystal oscillator (OCXO) as a master reference, providing multiple outputs locked to the reference frequency. On-board functions implemented with the micro-controller include: serial communications, frequency adjustment, output status (on/off), LED indicator status, temperature sensing, alarms, storage and read-out of non volatile ID information, and remote program update capabilities. Custom requirements can be easily accommodated, which will simplify customer interfacing issues and reduce the need for the customer to have oscillator application engineering expertise. With this technology, Corning is now able to entertain new requests for board-level timing control products.
Corning
www.corning.com

Specifications at a glance:

• OCXO-referenced

• Multiple reference frequency-locked outputs

• Multiple on-board functions

• Remote program update capabilities