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SEQUANS Communications announced availability of its newest chip, the SQN1170, which integrates baseband, RF, and memory in a single chip.

Sequans also announced that Mitsumi is the first to use the chip to develop an SDIO module comprising full Mobile WiMAX system functionality. The SDIO module offers manufacturers a complete and highly flexible solution to quickly build high performance, low power-consuming Mobile WiMAX end-user devices. The SDIO module is the first of several modules Mitsumi is developing based on Sequans’ SQN1170.

The SQN1170 measures 12x12 mm² and delivers high throughput of more than 30 Mbps with very low power, consuming less than 600 mW total power in peak MIMO mode. The Mitsumi SDIO module measures a mere 400 mm², integrating with the SQN1170 all components necessary to deliver full Mobile WiMAX system functionality.

The SQN1170 can be used to build all types of mobile devices--from mobile phones to embedded PC applications to SDIO modules for consumer electronics devices. It also easily enables integrated combination designs such as WiFi/WiMAX half MiniCards with standard PCB and assembly technologies.

The SQN1170 is the sixth Mobile WiMAX chip Sequans has delivered, following a Mobile WiMAX Wave 1 chip in 2006, two baseband Mobile WiMAX Wave 2 chips in 2007 for base station and mobile stations and two RF chips (2.5 GHz and 3.5 GHz).