Stockholm -- Ericsson Technology Licensing announced a licensing agreement with Winbond Electronics Corp., a Taiwanese semiconductor manufacturer. The license agreement covers the Ericsson Core Bluetooth Radios KE-1 and KD-1.

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The license agreement enables Winbond to design and manufacture complete Bluetooth solutions together with a proprietary baseband. Marie Khorsand, president of Ericsson Technology Licensing, said Winbond is a leading Asian semiconductor design and manufacturing company, and will help Ericsson grow in the Taiwanese Bluetooth market.