Infineon Technologies has developed 128 Mbit mobile RAM. Designed specifically for use in battery-powered handheld electronic products, the mobile RAM is a low-power synchronous dynamic random access memory (SDRAM), mounted in a space-saving, fine-pitch ball grid array (FBGA) package that is fully compliant with the new joint electron device engineering council (JEDEC) standard. Compared to standard thin small-outline package (TSOP)-mounted SDRAM, the form factor of the RAM is reduced by more than a factor of three, with the FBGA occupying a footprint of just 8 mm × 9 mm. Power consumption can be reduced by as much as 80% compared to standard 128 Mbit SDRAM, depending on the operating conditions and system design. Additional power saving functions include an operating voltage of 2.5 VDC and I/O voltage of 1.8 VDC or 2.5 VDC, as well as a special power management as specified by the recent JEDEC standardization of the low-power SDRAM devices. Mobile RAM represents a significant step in the program to maximize battery life size, weight and total system cost of the next generation of personal digital assistants, smart phones and digital still cameras. Infineon's product roadmap for mobile RAM includes the 128-Mbit part in x8 and x16 organizations, as well as plans to introduce a 256-Mbit version in 2002. The 128-Mbit mobile RAM is suited for a growing number of higher-end systems. The next-generation mobile-RAM will provide this memory density by using just two FBGA devices. Later this year, Infineon will offer mobile-RAM samples both in the new JEDEC-standardized 54-ball FBGA package, and in standard TSOP-mounts to simplify system evaluation for customers working with development hardware laid out for the larger package. All production volume of the RAM will be mounted in the FBGA. Features of the RAM include: 8M × 16 organization, 54-ball, temperature compensation of refresh rate, partial array select and 256M density in preparation.
Specifications at a glance:
- 128 Mbit capacity
- 2.5 VDC operation with 1.8 VDC I/O voltage
- FBGA packaging
- JEDEC standard