AT&T and Cinterion Wireless Modules have announced the launch of the AT&T Connection Kit for Device Developers with Cinterion Wireless Modules. According to the companies, the kit includes everything that designers need to develop HSPA specialty wireless solutions for machine-to-machine (M2M) applications for virtually any industry or vertical market.
The AT&T Connection Kit program is designed to provide the tools and environment necessary to streamline device development and optimize performance on AT&T’s 3G network. The latest kit includes Cinterion’s next-generation HC25 module, which supports quad-band GSM/GPRS/EDGE and tri-band UMTS/HSDPA frequencies for worldwide functionality for sophisticated enterprise devices and solutions such as PDAs and industrial handhelds.
The kit also includes AT&T SIM cards, data capacity for testing, access to the AT&T Control Center, powered by Jasper Wireless, and best practice guidelines to bring approved devices to market faster than ever before, the companies claim. Additionally, the companies say that users will have the peace of mind of working with M2M industry leaders with more than a decade of experience in enabling M2M deployments.
The AT&T Connection Kit with Cinterion Wireless Module set builds on the existing AT&T Connection Kit for Device Developer program available through the dedicated AT&T emerging devices Web site. For more about AT&T’s Emerging Devices Organization or to see additional Connection Kit options, go to www.att.com/edo. To order a kit, register for a referral code at att.m2m.com/cinterion/.