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OTEK has added its model SEB (switchboard LED bar graph) to its line of low-cost bar graphs with LCD or LED display and serial I/O. The SEB can be purchased as an indicator only (no outputs) or V/mA or serial input (as a remote display) or as an indicator/controller with outputs such as relays (up to four), analog output (4 V to 20 V, or 0 V to 5 V), RS-232, 485, USB or Ethernet and any power input from 5 Vdc to 32 Vdc or 90 Vac to 265 Vac.
As an indicator only, the SEB is only one inch on the front panel with no depth behind, other than the Euro-style screw connector. Zero and span is done with two front-panel potentiometers and configuration via the RS-232 RJ11 port under the display. For the “controller” version, a two-inch-deep module is plugged in the SEB behind the panel. This module contains the relays, analog outputs, RS-232, 485, USB and Ethernet interface as well as power supplies.
An optional 30 Vdc output to power 4 mA to 20 mA transmitters is available, eliminating the need for additional power supplies.
Standard input signals are Vdc/mA including current loop. Options for any signal (such as TC, RTD, S-G, RMS, pH and %RH) are available. Mil-Spec, nuclear, hazardous and industrial grades are available.
Precision foil resistors
Vishay Intertechnology's improved Z201 ultrahigh-precision Z-foil resistor provides a TCR of ±0.05 ppm/°C from 0 °C to +60 °C and ±0.2 ppm/°C from -55 °C to +125 °C, a PCR (ΔR due to self heating) of ±5 ppm at rated power, tight tolerances of ±0.005% and a load life stability of ±0.005%. “Z-based” foil technology provides a significant reduction of the resistive components' sensitivity to ambient temperature variations from TCR and applied power changes due to PCR.
The Z201 device has a load-life stability of ±0.005% for 2000 hours at 70 °C; a resistance range of 10Ω to 100 kΩ; a power rating of 0.3 W at 125 °C; current noise less than -40 dB; and thermal EMF of 0.1 µV °C max (0.05 µV °C typical). It offers high-frequency operation with a rise time of 1.0 ns without ringing, and features a non-inductive, non-capacitive design. The device offers a small package size, and functions as a drop-in replacement for the earlier S102C/K series of resistors.
Despite a great deal of effort during the past decade, electrostatic discharge (ESD) still affects production yields, manufacturing costs, product quality, product reliability, and profitability. Industry experts have estimated actual cost of ESD damage to the electronics industry as running into the billions of dollars annually. The Z201 resistor has an ESD immunity above 25,000 V, putting it over the top requirements of all three of the highest ESD standard classifications.
Because of its specifications, the new Z201 will reduce solution costs, allowing designers to rely on consistent resistor performance to overcome the limitations of other components and to reduce the need for end product testing. Samples and production quantities of the improved Z201 Z-foil resistor are available.
Clad molybdenum wire
Anomet's clad molybdenum wire is a metallurgically bonded alternative to solid wire and is capable of withstanding temperatures up to 1200 °C, depending upon the material and application. Featuring either platinum or nickel cladding, depending upon the desired surface properties, this metallurgically bonded wire is available straight, spooled and as ribbon.
Providing superior ductility, formability and weldability, versus wire that is plated or produced using deposition methods, clad molybdenum wire is offered in sizes from 0.004 inches O.D. to 0.060 inches O.D. with claddings from 14% to 38% by weight, and 4.5 µm to 55 µm, depending upon diameter. Applications include high vacuum devices and components for furnaces and sensors. Anomet clad molybdenum wire is priced according to configuration and quantity.
WLAN power amplifier
M/A-COM's lightweight cable assembly uses the FN34RXLW cable, a lightweight version of its FN34RX cable assemblies. This product is intended for use with military aerospace applications. With performance to 18 GHz and operational at temperatures up to +200 °C, this generation of high-performance cables for electronic warfare and other special-purpose airborne applications are more than 30% lighter. The new M/A-COM cable assemblies use different construction materials and reduced-mass connector designs to reduce weight by one-third. Applications range from UAVs to commercial and military aircraft, enabling increasing capacity, fuel economy, and flight times.
Micropac's Optoelectronic division has introduced the 66226 optocoupler. It consists of an 850 nm GaAIAs LED optically coupled to a photodiode detector and a 2N2222 transistor all mounted in a hermetic six-pin LCC package. This configuration has proven to be highly tolerant to both proton and total dose radiation. It is designed to meet or exceed MIL-PRF-19500 radiation requirements. The 850 nm LED has proven to be more tolerant of operating temperatures over 100 °C than the more commonly used 660 nm LED. The device provides input/output isolation as high as 1000 V.
Fully insulated, fire-retardant insulated terminals that come in flag and straight styles and feature high integrity “F” crimp connections for use in appliances are available from ETCO.
ETCO insulated disconnects feature an open-barrel “F” crimp wire attachment to assure a high integrity connection and are constructed from a high-temperature alloy and fire-retardant nylon insulator. Available in flag and straight styles to mate with 0.110 in. × 0.020 in., 0.187 in. × 0.020 in., and 0.250 in. × 0.032 in. NEMA male tabs, they are designed for automated wire processing equipment.
Produced to UL and NEMA specifications and supplied in strip form, ETCO insulated disconnects are rated to 150 °C. If there is a malfunction, the fire-retardant nylon insulator collapses on itself and safely holds until the appliance completes an automatic shutdown. Literature and samples are available upon request.
IERC is offering a new line of custom aluminum iZIF heat frames designed for use in rugged military and commercial applications. This iZIF integrates a heat frame and a circuit board retainer into a single unit, thus eliminating any need for assembly while improving thermal performance.
Highlighted features include:
iZIF is fully integrated into a heat frame;
zero insertion/extraction force (ZIF);
one-quarter turn lock/unlock — quick disconnect;
thermal performance per length is ≤1.2 ° C-in/W;
uniform clamping force and uniform thermal distribution over entire length;
consists of two components, which results in high reliability;
no torque wrench or special tool required;
new standard ⅛-inch SHCS-drive (Allen-key) clamping/locking rod.
IERC's engineering staff has extensive thermal management and packaging experience and offers technical assistance for custom designs.
Hypertronics has announced a new micro-miniature connector technology that is optimized for high reliability, military/aerospace applications. Based upon a contact system licensed from Ardent Concepts, the HyperGrid technology features RC spring probe contact technology — proven in rugged test-bed applications. The technology also employs solderless, compression-style connections requiring 20 grams of force per node to maintain connectivity, with a contact pitch as low as 0.4 mm, ideal for high density designs. In addition, the series exhibits excellent ac performance, with multi-GHz bandwidth, exceptional signal integrity and consistent dc resistance.
HyperGrid technology results in interconnect solutions that offer the same tiny form factor, high node count and stackability features required in many microminiature applications, without the electrical, repeatability or cost limitations associated with other technologies such as pogo pins, fuzz buttons, and conductive elastomers. The scalable HyperGrid technology will be available as custom interconnects for PCB-to-PCB, flex cable-to-PCB, and IC-to-PCB designs.
This new form factor opens portable, handheld, avionic and other space- and weight- constrained applications to the high reliability, repeatability and rugged designs of Hypertronics. The license agreement with Ardent Concepts is exclusive for military/aerospace applications enabling Hypertronics to provide specialized military/aero-space customers with unique interconnect solutions.
Diodes Inc. has introduced its SBR product family packaged in Diodes' high-performance PowerDI123. The 3 A SBR rectifier product family exhibits ultralow VF for high efficiency, combined with high-temperature thermal stability, and robust ESD ratings of ±16 kV HBM, and much higher reverse avalanche capability compared to traditional Schottky technology. These features contribute to excellent efficiency, superior reliability and a wide safe operating area in applications such as dc-dc converters and in small portable electronics.
Combined with PowerDI123's flat leadframe package, the 3A SBR product family combines highly efficient wafer technology with a high-performance power dissipation package. For instance, the SBR3U30P1 SBR exhibits a high maximum junction temperature rating of 150 °C. This results in device parameters that are superior to standard Schottky technology and are suited to the efficiency and thermal requirements of compact one-eighth brick and one-sixteenth brick dc-/dc converters.
Diodes is releasing six SBR diodes in the PowerDI123 package platform. The SBR3U30P1 SBR device achieves a continuous forward current rating of 3 A. The SBR3M30P1 with its even higher maximum junction temperature of 175 °C is suited for high-temperature applications where efficiency and reliability are critical to the design. In addition to the 3 A devices, the SBR PowerDI 123 family includes a 2 A ultralow VF version, SBR2U30P1; a 2 A ultralow leakage version, SBR2M30P1; and 30 V/40 V low VF versions, SBR2A30P1 and SBR2A40P1.
PMC/XMC transceiver module
Pentek has introduced its model 7141-703 PMC/XMC module that is a ruggedized and fully compliant with the ANSI/VITA 20 conduction-cooling specification and the ANSI/VITA 42 XMC specification. It features two 14-bit, 125 MHz ADCs and a Xilinx Virtex-II Pro field-programmable gate array (FPGA). This module is compatible with cPCI and VME baseboards.
The 7141-703 offers conduction-cooled solutions deployable in harsh conditions, as well as better performance with improved signal-to-noise characteristics and a 20 MHz increase in the sampling rate for wider bandwidth coverage, while reducing power consumption.
Pentek integrated extended temperature-range components within a thermally efficient housing to ensure effective heat transfer to the carrier board. The module has an extended operating temperature range of -40 °C to +70 °C. Because of its high-speed capability and ruggedized construction, the 7141-703 is suited for designs in a variety of market sectors where there is a need for wideband software radio resources in harsh environments. These include a significant range of military and aerospace applications such as unmanned aerial vehicles, battleground SIGINT and communications systems, deployment on tanks or torpedoes, or any system in which ambient or forced air will not provide adequate cooling.
The 7141-703 benefits from all of Pentek's GateFlow FPGA resources. The GateFlow FPGA design kit provides designers with all VHSIC hardware fescription language (VHDL) source code and device configuration for the basic factory-installed functions to facilitate the addition of custom algorithms. The developer is able to incorporate proprietary IP with the IP that is shipped with the board, so that together they become the functionality of the entire 7141-703 board.
The model 7141-703 PMC/XMC module prices start at $15,995.