RF, analog, baseband, and memory functionality in one mixed-signal CMOS device
Zeevo new system-on-a-chip (SoC) solution includes RF, analog, digital baseband, and memory functionality in one mixed-signal CMOS device. Designated as the TC2000, the device is designed to minimize required external components to provide a full system solution. The chip provides a platform that makes implementation easier for integrated Bluetooth silicon devices and technology. The device includes all hardware and software (stack profiles), offers a development environment and includes reference designs as well. The TC2000's features include high sensitivity (measured at the antenna, after the filter), excellent noise tolerance, a standard CPU, and all advanced Bluetooth features. Zeevo also provides a proprietary Turbo Mode that increases throughput two to four times. The TC2000 meets or exceeds Bluetooth small size and low power consumption requirements. Packaged in a low-temperature, co-fired ceramic (LTCC) package to control noise, the TC2000 has RF components (including filters and shield but excluding the antenna) integrated around the chip in the package. There is a single-pin RF interface so customers can mount it just like a regular component, effectively making it a “digital-looking” chip. The IP is re-usable and scalable across the fast-growing communications markets, providing longevity and obsolescence-proof products. Its technical features include a frequency range of 2.4 - 2.4835 GHz for ISM band applications: personal computers, PDA, PC accessories, LAN access points, printers, gaming devices. It is built on a 0.18um CMOS process and includes all necessary RF, CPU, and radio subsystems.