Amkor Technology and IMEC of Europe have entered into a two-year collaboration agreement to develop cost-effective, 3D-integration technology based on wafer-level processing techniques.

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"This collaboration with IMEC will enhance our continuing efforts to develop low-cost, state-of-the-art packaging solutions for our customers", said Dan Mis, Amkor's Senior Vice President for Wafer-Level Advanced Product Development.

Luc Van den hove, IMEC's Executive Vice President and Chief Operating Officer, states, "We are pleased that one of the leading semiconductor-packaging service providers has joined our 3D-system-integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond-pad level."