Incremental Improvements Define The 2012 Mobile World Congress |
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Louis E. Frenzel, Editor in Chief
The usual players all showed up at this year’s Mobile World Congress in Barcelona with lots of improved devices, but no real game-changing breakthroughs... |
AMKOR and IMEC to jointly develop 3D wafer-level packaging
Amkor Technology and IMEC of Europe have entered into a two-year collaboration agreement to develop cost-effective, 3D-integration technology based on wafer-level processing techniques. ...
TI’s wireless infrastructure DSPs capture China’s 3G market
Latest 3G news from China indicates that Texas Instruments digital signal processors (DSPs) are gaining ground in this market. ...
Handheld analyzers eye LMR and public safety operators
Anritsu Co.'s S311D/S312D Site Master cable and antenna analyzers are designed to test the RF performance of P25 and TETRA systems in the VHF/UHF, 400 MHz, and 700-800 MHz bands. ...
New VCOs offer enhanced durability, easy integration
Crystek Corp.'s new line of VCOs, labeled Red Box series, come in robust aluminum enclosure with SMA connectors. ...
High-power hybrid-ring divider/combiners cover wireless bands
MECA's two high-power, hybrid ring divider/combiners cover wireless bands from 0.810 GHz to 0.960 GHz and 1.700 GHz to 2.000 GHz. ...
Microwave catalog details terminators and attenuators
IRC’s Advanced Film Division’s high-frequency products catalog outlines the family of line terminators and attenuators, which include both chip and flanged high-power RF and microwave devices. ...
Quad analog switches suit power and communications
Vishay Intertechnology’s series of quad SPST CMOS analog switches combine high switching speeds with high signal bandwidth for use in a wide range of switching applications, including audio, video, data, and power. ...
Teardown reveals Apple's iPhone components
Teardown analysis by iSuppli of Apple’s iPhone reveals Infineon Technologies, National Semiconductor and Balda provide key components in the device, along with established vendors such as Samsung Electronics. ...
Stand-alone fingerprint module makes biometrics affordable
After nearly three years of code development, and protected by several pending patents, ODI Security, LLC has readied a low cost, power efficient stand-alone embedded fingerprint module for consumer and commercial applications. ...
Fully integrated test system characterizes error/noise performance
With the addition of the new G.703 Interface Pod option, the Aeroflex FB100A bit error rate tester can now test a wide range of standardized telecommunications interfaces. ...
Ultra-small antenna eyes portables devices
Antenna solutions provider Antenova Ltd. has added a new member to its miniature family of antennas. ...
Quad, high-speed, high-bandwidth video switch maintains signal integrity
Maxim Integrated Products has released a quad, high-speed, high-bandwidth, HDMI/DVI passive switch capable of switching between two digital video signals into a single monitor or multiple HDMI/DVI connectors while maintaining a high level of signal integrity. ...
Compact power meter supports LAN based automated measurements
Agilent Technologies Inc. has introduced a LXI-compliant power meter that is slim, compact 1U high, and supports LAN-based automated measurements of peak, peak-to-average ratio and average power....
Alternative to SMT for microwave and millimeter-wave systems
Conventional SMT works well for frequencies up to about 6 GHz. However, at higher frequencies SMT is usually not a viable option because in SMT topology the transmission lines are unshielded, and the components do not have adequate grounding. ...
India is becoming a research hub for global electronics
Next month, India will celebrate 60 years of freedom and democracy. In that time, it has made significant progress in science and technology. ...
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