CAD implementation of DR-based oscillator using non-linear analysis 

Mar 1, 2007, By Kamaljeet Singh and Surendra Pal

The concept of modeling along with the simple design equations, characterization and implementation of the dielectric resonator puck model in oscillator simulation, are presented....

On-chip phase-change memory module operates at high speed 

Feb 22, 2007

Hitachi and Renesas Technology have developed a 512 KB phase-change memory module operating from 1.5 V. The device achieves write speeds of 416 KBps and read access times of 20 ns. ...

Technique stabilizes 45 nm bulk CMOS on-chip SRAM 

Feb 22, 2007

Renesas Technology and Matsushita Electric have developed a technique that achieves stable operation with 45 nm process generation bulk CMOS for SRAM that can be embedded in SoC devices and microprocessors. ...

PIN diodes feature MELF packaging 

Feb 22, 2007

NH-MicroMetrics' non-magnetic metal-electrode-leadless-faced- packaged PIN Diodes that feature high power handling and low distortion. The diodes are designed for switching and attenuator applications from HF through UHF frequencies....

Miniature software-based radio ICs enable navigation in mobile handsets 

Feb 15, 2007

SiGe Semiconductor has released what it claims is smallest global navigation satellite system (GNSS) receiver ICs for mobile handsets, cellular telephones, personal navigation devices (PNDs) and personal digital assistants (PDAs). ...

Ceramic diversity antennas enable high data rates 

Feb 15, 2007

Pulse, a Technitrol Company, has announced a new line of high-performance ceramic diversity antennas. ...

Bluetooth chip targets computing platforms 

Feb 6, 2007, By Mark Valentine, Technical Editor

The AR3011 from Atheros Communications is the first member of the ROCm Radio-on-Chip for Mobile family of Bluetooth solutions. ...

Downconverting mixer suits 3G and WiMAX base stations 

Feb 6, 2007

The LT5557 from Linear Technology is a high-linearity, 3.3 V, downconverting active RF mixer. ...

Insulation technology permits contact between IC bonding wires 

Feb 6, 2007

Microbonds together with Tanaka Denshi Kogyo has certified the technology readiness of Tanaka to manufacture X-Wire....

Northrop Grumman receives multimillion-dollar contract to expand targeting capabilities for Joint STARS 

Feb 1, 2007

Northrop Grumman Corporation has received a $56.2 million contract from the U.S. Air Force to provide an enhanced land/maritime mode (ELMM) mobile target...

Products 

Feb 1, 2007

Tricolor bar graph OTEK has added its model SEB (switchboard LED bar graph) to its line of low-cost bar graphs with LCD or LED display and serial I/O....

Army awards HYPRES contract to develop RF electronics 

Feb 1, 2007

HYPRES has received two new contracts totaling approximately $1.5 million from the U.S. Army's Communications-Electronics Research, Development and Engineering...

ADAPTIX issues patent covering adaptive subcarrier clusters 

Feb 1, 2007

The U.S. Patent and Trademarks Office (USPTO) has issued U.S. Patent No. 7,146,172, entitled Multicarrier Communications with Adaptive Cluster Configuration...

Boeing to test sniper fire detection and location technology 

Feb 1, 2007

Boeing has been awarded a U.S. Air Force contract for a ground situational awareness toolkit (GSAT) that integrates a ScanEagle unmanned aircraft system...

SiC technology will meet the military's future needs 

Feb 1, 2007, By Marcelo Schupbach and Alexander Lostetter

While reduction in size, weight and thermal management requirements enabled by SiC technology will meet the demands of future military systems, the military, as an early adopter, will speed the development of SiC devices for commercial applications....

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