Staccato Communications’ Wafer Chip Scale Package (WCSP) is based on Staccato’s Ripcord single-chip, all-CMOS UWB solution. The form factor of 7.5 mm by 7.5 mm is well suited for mobile applications.

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With WCSP, packaging occurs at the wafer level, allowing a low-cost and efficient manufacturing flow. The package provides a high level of flexibility in system designs by enabling modules of various materials from LTCC to organic substrates to simple FR4-based PC board designs. The WCSP is expected to be available for general sampling later in the first quarter of 2007.