ST, Octasic ink deal for VoP telecom ICs
Semiconductor supplier STMicroelectronics and Octasic Inc., a fabless telecom semiconductor company, have signed an agreement to deliver a family of leading-edge Voice-over-Packet (VoP) ICs. The first ICs developed under this agreement will be based on ST’s 0.13-µm and 90-nm semiconductor process technologies and Octasic’s designs for Voice over Packet (VoP) and Voice Quality Enhancement (VQE), which includes technology for line and acoustic echo cancellation, noise reduction capabilities, vocoding and packetization. The first IC of the family will be available in the second quater, with the second one shortly afterward, said the partners. The agreement also provides for the development of future system-on-a-chip (SoC) VoP devices, which will be implemented in 90-nm and below process technologies.
“Given our current product portfolio for this market, which includes state-of-the-art wireless base-station ICs, providing best-in-class solutions for telecom voice applications is a natural complement,” said Daniel Abecassis, group vice president and general manager of the Wireless Infrastructure Division of STMicroelectronics. “Octasic is a leader in VoP and voice quality technology for telecom infrastructure markets, and ST is one of the world’s largest semiconductor vendors with world-class process technology and manufacturing. The two companies will be able to leverage each other’s expertise to design and produce leading-edge products for top tier telecom customers.”
“A successful business relationship is built by forming alliances that help customers obtain a reliable source of high-performance technology. Together with STMicroelectronics, we will be able to design fully optimized devices in the latest silicon technology with high performance and low power consumption, perfectly matching customer needs,” said Michel Laurence, CEO of Octasic. “This agreement will enable us to offer great assurance of supply and support to our customers and provide Octasic with the stability and technical competence to take our future devices to a whole new level.”
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