Enthone, a business of Cookson Electronics, announced the opening of a Semiconductor Applications Center in Toayuan, Taiwan. The multimillion-dollar investment enables the company to deliver customer-driven solutions to the wafer fabrication marketplace. The center supports the firm's MICROFAB® bump wafer processes and ViaForm® wafer deposition electrodeposition technologies. The center provides wafer sample plating and testing for process optimization for different applications, and is staffed by a team of application engineers.

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According to Raymond Fong, Vice-President and Managing Director for Enthone Asia, "Taiwan represents over 65 percent of the world's semiconductor foundry manufacturing, as well as 60 percent of the world's semiconductor packaging market. The center is strategically located to further support and collaborate with these world leaders on new and emerging technologies as they advance their product portfolio and implement higher performance, more cost-effective wafer manufacturing throughout the Asia-Pacific region and across the globe."

Cookson Electronics (www.cooksonelectronics.com)