Mobile WiMAX chipset is optimized for embedded modules
To offer low power consumption and small form factor, Fujitsu Microelectronics America, Inc. has released a new mobile WiMAX chipset optimized for small, embedded modules targeting mobile devices like smart phones and PDAs. The chipset includes a baseband IC MB86K22, an RF IC MB86K52, and a power management chip MB39C316. These three devices are essential elements for competitive WiMAX modules, said the supplier. The chipset was designed to keep the WiMAX module at 12 x 12 mm. The idle current, which has a direct impact on battery life, will not exceed 0.5 mA, stated Fujitsu.
According to the maker, the next-generation mobile WiMAX technology will be deployed in the United States, Europe, and Taiwan this year, and in Japan next year. The initial service will be through PC-based mobile broadband access, with simultaneous development of handsets, smart phones, PDAs, portable games and navigation systems.
The MB86K22 is a fully integrated baseband IC built using the Fujitsuís 65 nm advanced CMOS low-leakage process technology. The operating power of the baseband chip has been reduced by 36% from the previous generation. Additionally, the power-gating technology shuts down the power supply in the unused blocks inside the device, so that the entire mobile WiMAX module consumes only 0.5mA.
Likewise, the RFIC MB86K52 is implemented using CMOS process technology, and supports 2.3 GHz, 2.5 GHz, and 3.5 GHz, almost all the frequencies set by the WiMAX Forum. Plus, it also supports MIMO and beamforming technology, which are essential for mobile WiMAX Wave 2.
Lastly, the power management chip MB39C316 eliminates all the complex and time-consuming power management requirements by accommodating one cell battery. This design minimizes the peripheral components outside of the module. Furthermore, it controls and manages the moduleís power schemes at the system level, achieving the lowest power consumption at each operation.
Fujitsu plans to sample the chipset in August.
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