Platform in package targets ZigBee applications
Freescale Semiconductor is now sampling the next-generation MC13224 device in its single-chip IEEE 802.15.4/ZigBee platform-in-package. This latest addition to the MC1322x family is designed for a range of wireless applications, including energy management, commercial building automation, industrial control and monitoring and home entertainment control. It supports existing protocols, such as SMAC, IEEE 802.15.4 MAC, ZigBee stack and Synkro network protocol stack, with the ability to support the WirelessHART specification, ISA100 and 6LoWPAN.
The MC13224 device is based on the IEEE 802.15.4 specification and designed to provide a highly integrated, total solution with premier processing capabilities and low power consumption. It contains a 32-bit ARM7 microcontroller, a fully compliant IEEE 802.15.4 transceiver, flash, RAM and ROM, high-performance peripherals, balun and RF matching components. This is all integrated into a small-footprint land-grid array (LGA) package that virtually eliminates the need for external RF matching components, thereby decreasing time- to-market and overall system cost, stated Freescale.
Typical transmit currents of 28 mA and receive currents of 21 mA can even be lower with MCU bus stealing enabled. With receive sensitivity of up to -100 dBm and maximum output power of + 5 dBm, it offers the highest link margin of any device currently available in the industry, claimed the maker. Onboard power supply regulation is provided for source voltages from 1.8 Vdc to 3.6 Vdc, and can operate over an extended temperature range up to +105 °C.
Production quantities are expected to be available in September. Suggested resale pricing for the MC13224V in 10,000 quantities is $4.99.
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