SDK Supports CEVA-XC323 DSP
MD&D News Staff
Enabling rapid design of multimode software-defined modems, Ceva’s CEVA-XC software development kit (SDK) supports the CEVA-XC323 DSP silicon operating at 800 MHz...
The Last Mile: Opportunities for WiMAX 2008-2013
Research and Markets announced the addition of “The Last Mile: Opportunities for WiMAX 2008-2013” to their offering. ...
IAR Systems and Freescale partner on ZigBee design kit
IAR Systems has announced an agreement with the Wireless Connectivity Group of Freescale Semiconductor to include IAR Systems development tools and debug probe in the next generation of Freescale’s development kits based on the MC1322x IEEE 802.15.4 Platform-in-Package (PiP) IC. ...
Wi-Fi TV exclusive Internet TV stations
New versions of several exclusive Wi-Fi TV Internet channels launched at the NAB Show in Las Vegas. ...
Agilent Technologies WiMAX test solution selected by Universal Scientific
Agilent Technologies Inc. announced that Universal Scientific Industrial Co. Ltd. ...
CSR ships one billion Bluetooth chips
CSR announced that is has shipped its billionth Bluetooth chip. ...
First 8 Mobile WiMAX products receive WiMAX Forum Certified Seal of Approval
At WiMAX Forum Asia Congress 2008 (April 9-10), the WiMAX Forum announced that the first eight Mobile WiMAX products received the WiMAX Forum Certified Seal of Approval following rigorous testing to ensure that each product meets strict interoperability and conformance to standards. ...
SiGe PA optimizes performance of WiFi systems
SiGe Semiconductor, Inc. has developed a new 2.4 GHz power amplifier (PA) using its proven architecture and advanced silicon germanium (SiGe) process...
Dual SCART saves power, cuts component count in set-top boxes and A/V receivers
Maxim Integrated Products’ MAX9598 is a +3.3 V dual SCART solution for set-top boxes and A/V receivers...
Freescale taps IAR tools for ZigBee design kit
IAR Systems will offer development tools and debug probe to Freescale for use in its development kits based on the MC1322x IEEE 802.15.4 platform-in-package (PiP) IC...
CSR demonstrates ULP Bluetooth
CSR demonstrated its ultralow power (ULP) Bluetooth silicon, which consisted of two ICs successfully transferring ULP Bluetooth data packets 50-times faster than standard Bluetooth...
Aeroflex, Innowireless partnership accelerates development of 3G LTE mobile devices
Aeroflex Test Solutions’ Wireless Division has entered into a technology partnership with Korea’s Innowireless that will will enable the two companies to collaborate on the development of a new 3G LTE mobile test tool...
ST, NXP merge wireless businesses to form a joint venture
Europe’s two giant semiconductor suppliers, NXP and STMicroelectronics have agreed to combine key wireless operations to form a joint-venture company with strong relationships with all major handset manufacturers...
Film capacitors simplify EMI filter design
With its new B3292*E/F series film capacitors, EPCOS now offers X2 safety class capacitors with capacitances up to 45 μF...
VCO offers ultralow phase noise, high linearity
Crystek's CVCO55CC-1260-1400 VCO operates from 1260 MHz to 1400 MHz with a control voltage range of 0.5 V~12 V...
Thyristor provides overvoltage protection to DSL lines
Littlefuse has added a new overvoltage protection series, the TwinChip SDP, to its broadband optimized SIDACtor product line...
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