Infineon, Motorola agree to develop 3G RF chip
Germany’s Infineon Technologies AG has inked an agreement with Motorola to develop a new multimode, single-chip 3G RF transceiver based on its SMARTi UE chip. Motorola believes that the new RF chip will address this growing market for 3G services by offering maximum HSDPA and HSUPA performance, efficient power consumption and slim design. However, terms of the development agreement were not disclosed.
"We are pleased to enter into this strategic relationship with Motorola to create an advanced 3G RF solution based on our leading SMARTi UE chip. The new chip will effectively reduce size and footprint for next generation 3G devices and offer best in class radio performance at market leading system cost," commented Stefan Wolff, vice president and general manager of Infineon’s RF Engine Business Unit.
“GSM-based technologies will be dominant for the early forecast period, accounting for just under 70% of all production in 2006. However, the market is rapidly switching over to 3G-based technologies of various types", stated Alan Brown, research director at Gartner. "The main 3G variant is WCDMA (including HSPA and LTE), and this will be produced in high volumes worldwide in 2010, representing 56% of total production."
According to Infineon, the 130 nm CMOS based SMARTi UE is sampling to select customers with production ramp up planned for the 2nd half of 2008. The chip supports all global UMTS band combinations (I-VI and VIII-X) as well as quad-band EDGE. Meanwhile, the new version, which will include Motorola IPs, is expected to be unveiled sometimes later next year using 130 nm CMOS process.
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