The Qualcomm RF360 front-end solution addresses cellular radio frequency band fragmentation and enables a single, global 4G LTE design for mobile devices that supports all seven cellular modes: LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA, and GSM/EDGE.

The RF360 is designed to work seamlessly, reduce power consumption, and improve radio performance while reducing the RF front-end footprint inside a smart phone by up to 50% compared to other current devices. By reducing design complexity and development costs, Qualcomm adds, the RF360 lets OEM customers develop new multiband, multimode LTE products faster and more efficiently.

The chip’s QFE15xx modem-assisted, configurable dynamic antenna matching tuner extends the antenna range to operate over 2G/3G/4G LTE frequency bands from 700 to 2700 MHz. Combined with modem control and sensor input, it dynamically improves the antenna’s performance and connection reliability in the presence of physical signal impediments, like the user’s hand.

The QFE11xx envelope power tracker is the industry’s first modem-assisted envelope tracking technology designed for 3G/4G LTE mobile devices, Qualcomm says. It’s also designed to reduce overall thermal footprint and RF power consumption by up to 30%, depending on the mode of operation. By reducing power and heat dissipation, the company says, OEMs can design thinner smart phones with longer battery life.

The QFE23xx integrated CMOS power amplifier/antenna switch offers multiband support across 2G, 3G, and 4G LTE cellular modes. According to Qualcomm, it provides unprecedented functionality in a single component with smaller printed-circuit board (PCB) area, simplified routing, and one of the smallest power amplifier/antenna switch footprints in the industry.

The QFE27xx RF POP 3D RF packaging solution integrates the QFE23xx multimode, multiband power amplifier and antenna switch with all the associated surface acoustic wave (SAW) filters and duplexers in a single package. Designed to be easily interchangeable, the QFE27xx lets OEMs change the substrate configuration to support global and/or region-specific frequency band combinations.

Meanwhile, the WTR1625L RF transceiver chip supports carrier aggregation with a significant expansion in the number of active RF bands, Qualcomm says. It can accommodate all cellular modes and 2G, 3G, and 4G/LTE frequency bands and band combinations that are deployed or in commercial planning globally. Also, its high-performance GPS core supports the GLONASS and Beidou systems. Integrated in a wafer-scale package, the WTR1625L uses 20% less power than previous generations.