The Agilent Technologies Advanced Design System (ADS) 2012 RF and microwave EDA software platform is designed to improve productivity and efficiency for all applications that the system supports. Its technologies are applicable to gallium-arsenide (GaAs), gallium-nitride (GaN), and silicon RF power-amplifier multichip module design. Compared to previous editions, its user interface enhancements are designed to improve design efficiency and productivity, such as dockable windows for quickly accessing frequently used dialog boxes. Its updated Load Pull and Amplifier DesignGuides offer mismatch simulation and make it easy to see amplifier performance at a specific output power level or a specific amount of gain, respectively, according to the company.

Furthermore, its EMPro dramatically improves integration, Agilent says, and enables 3D electromagnetic component designs to be saved as database cells for use directly in ADS. A new ADS electrothermal simulator incorporates dynamic temperature effects to improve accuracy in “thermally aware” circuit-simulation results. Its multichip module electromagnetic simulation setup and Finite Element Method simulation of different technologies supports analysis of electromagnetic interactions between circuits and interconnects, wire bond, and flip-chip solder bumps in typical multichip RF power-amplifier modules. And, the package offers model support for Agilent’s artificial neural network-based NeuroFET model to enable more accurate FET modeling and simulation results.

ADS 2012 is now available for download at

Agilent Technologies