The Advanced Film Division of TT electronics’ IRC has enhanced its thin-film microwave circuit capabilities with polished ceramic substrates. This provides design engineers with better edge definition on transmission lines and distributed circuit elements. Now available in 0.010-inch thickness, the polished substrates reduce propagation delay due to shorter signal paths.

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According to Jerry Seams, applications engineering manager for TT electronics IRC Advanced Film Division, the polished ceramic results in reduced in-circuit transmission line losses. “The polished ceramic provides approximately 0.2 dB improvement in line loss per inch on 0.025 inch thick alumina transmission line,” said Seams. “Additionally, the 0.010-inch thickness of the substrate allows for smaller circuit and element geometries, as well as reduced circuit size.”

Other standard finish thicknesses are available in 0.015 inch, 0.020 inch and 0.025 inch, and polished ceramic substrates are available in 0.010-inch, 0.015-inch and 0.025-inch thicknesses.

Typical applications for the polished ceramic substrates include routers and switches, servers, computers, and microwave telecom links, as well as wireless applications. The substrates are also suitable for RF and microwave applications, including military, radar, avionics, and satellites.

Pricing for the polished ceramic substrates varies with complexity and volume.